RIGID PCB
PCB Capability | ||
| Item | Type | Normal Manufacturing Capability |
Material | Normal FR4 | Sheng Yi S1141,S1155(Halogen free) |
Hi TG FR4 | ITEQ IT180A , S1000-2 ,S1165(Halogen free),PCL-370HR,FR408,FR406,FR408H, N4000-13,N4000-13EP,N4000-13 SI,Megtron-6,Megtron-4,NP-180A,VT-47 . | |
Others | Rogers4350B,Rogers4003C,25N,25FR | |
PCB Type | Rigid PCB | HDI,Backplane,Multilayer Blind and Buired PCB, Heavy copper pcb,Back drill,Semiconductor test board . |
Layer Count | 1-30 layer for prototype , 1-28 layer for production | |
| Surface Treatment | Lead Free | HASL lead Free , ENIG, Immersion silver , Immersion Tin ,OSP,HARD GOLD,Soft Gold,Gold finger, ENEPIG |
Lead | Leaded HASL | |
Board Thickness | 8-275mil | |
Board Thickness Tol. | <=40mil +/-4mil ; >40mil +/-10% | |
Min.Line Width&Spacing | 3/2.5mil | |
Copper Thickness | 0.3 OZ -40 OZ | |
Min. Pitch | 0.35mm | |
Min. Board size | 0.4 inch *0.4 inch | |
Max. Board size | 23 inch *35 inch | |
Laminations | Blind&buired via | <= 3 times lamination |
HDI with laser via | 1+n+1;1+1+n+1+1;2+n+2;3+n+3;4+n+4 | |
| Hole | Min. Laser drill | 4mil(0.1mm) |
Min. Mechanical drill size | 4mil(0.1mm) | |
Hole Registration | +/-3mil | |
PTH Hole Tol. | +/-2mil | |
NPTH Hole Tol. | +0/-2mil or +2/-0mil | |
Max aspect ratio | 20:1 | |
Depth Tol. Of backdrill | +/-4mil | |
CounterSink Angle | 82° ,90°,120°,135° | |
Impedance Control | Single end | +/-5 OHM(<=50 OHM),Advance +/-5% |
Differential Pair | <=50 OHM +/-5 OHM , >50 ohm +/-10% , Advance +/-5% | |
Outline size Tolerance | +/-4mil | |
Outline location Tolerance | +/-4mil | |
Min. Bow&Twist | Advance 0.1% | |
Solder mask color | Green Glossy , Blue , green Matte , Red, Yellow ,White ,Purple | |
Min. Solder mask Birdge | 4mil(Green), 5mil(other color) | |
Silkscreen Color | White, Black,Yellow | |
Gold finger Bevelling Tol. | +/-5° | |
Min. Resistance Test | 10 OHM | |
MAX Insulation resistance Test | 100 OHM | |
MAX Test Voltage | 500V | |
MAX Test Currency | 200mA | |