PCBA
Assembly Capability | |
| Type | Normal Assembly Capability |
Max PCB size | 20inch*18inch |
Min. PCB size | 2inch*2inch |
Board thickness | 8mil-200mil |
Components size | 0201-150mm |
Component max height | 20mm |
Min lead pitch | 0.3mm |
Min BGA ball placement | 0.4mm |
Placement precision | +/- 0.05mm |
| Laser cut for Stencil manufacture for manual, semiautomatic and full automatic solder print machine, the accuracy can be 5um. | |
Services Range | Material Procurement and Management |
PCBA placement | |
PTH components soldering | |
POP | |
BGA re-ball and X-ray inspection | |
ICT, Functional testing and AOI inspection | |
Press fit connector assemblies process | |
Fabrication of Stencil | |
Box build, testing and assemblies | |
Function testing and assemblies | |