PCB Capability |
| Item | Type | Normal Manufacturing Capability |
| Material | Normal FR4 | Sheng Yi S1141,S1155(Halogen free) |
| Hi TG FR4 | ITEQ IT180A , S1000-2 ,S1165(Halogen free),PCL-370HR,FR408,FR406,FR408H, N4000-13,N4000-13EP,N4000-13 SI,Megtron-6,Megtron-4,NP-180A,VT-47 . |
| Others | Rogers4350B,Rogers4003C,25N,25FR |
| PCB Type | Rigid PCB | HDI,Backplane,Multilayer Blind and Buired PCB, Heavy copper pcb,Back drill,Semiconductor test board . |
| Layer Count | 1-30 layer for prototype , 1-28 layer for production |
| Surface Treatment | Lead Free | HASL lead Free , ENIG, Immersion silver , Immersion Tin ,OSP,HARD GOLD,Soft Gold,Gold finger, ENEPIG |
| Lead | Leaded HASL |
| Board Thickness | 8-275mil |
| Board Thickness Tol. | <=40mil +/-4mil ; >40mil +/-10% |
| Min.Line Width&Spacing | 3/2.5mil |
| Copper Thickness | 0.3 OZ -40 OZ |
| Min. Pitch | 0.35mm |
| Min. Board size | 0.4 inch *0.4 inch |
| Max. Board size | 23 inch *35 inch |
| Laminations | Blind&buired via | <= 3 times lamination |
| HDI with laser via | 1+n+1;1+1+n+1+1;2+n+2;3+n+3;4+n+4 |
| Hole | Min. Laser drill | 4mil(0.1mm) |
| Min. Mechanical drill size | 4mil(0.1mm) |
| Hole Registration | +/-3mil |
| PTH Hole Tol. | +/-2mil |
| NPTH Hole Tol. | +0/-2mil or +2/-0mil |
| Max aspect ratio | 20:1 |
| Depth Tol. Of backdrill | +/-4mil |
| CounterSink Angle | 82° ,90°,120°,135° |
| Impedance Control | Single end | +/-5 OHM(<=50 OHM),Advance +/-5% |
| Differential Pair | <=50 OHM +/-5 OHM , >50 ohm +/-10% , Advance +/-5% |
| Outline size Tolerance | +/-4mil |
| Outline location Tolerance | +/-4mil |
| Min. Bow&Twist | Advance 0.1% |
| Solder mask color | Green Glossy , Blue , green Matte , Red, Yellow ,White ,Purple |
| Min. Solder mask Birdge | 4mil(Green), 5mil(other color) |
| Silkscreen Color | White, Black,Yellow |
| Gold finger Bevelling Tol. | +/-5° |
| Min. Resistance Test | 10 OHM |
| MAX Insulation resistance Test | 100 OHM |
| MAX Test Voltage | 500V |
| MAX Test Currency | 200mA |
